PRODUCTION OF PARTICLEBOARD FROM CORN COB

dc.contributor.authorGUDETA DIRIBA
dc.contributor.authorNAOL AYALEW
dc.contributor.authorGEZAHEGN TAYE
dc.contributor.authorKITESA DABA
dc.contributor.authorTIZAZU TEMESGEN
dc.contributor.authorDEJENE TESEMA
dc.date.accessioned2024-04-19T07:41:25Z
dc.date.available2024-04-19T07:41:25Z
dc.date.issued2021-08
dc.description.abstractParticleboard is a wood-based panel product manufactured under pressure and temperature from the particles of wood or other any lignocellulose fibrous materials and a binder. This study presented an experimental work which investigates the potentiality corn cob in the production of particle board using modified starch adhesives and wood glue (top bond) as an alternative source of adhesive and also studied effects of control variables in the product. The corn cob particle, modified starch, wood glue (top bond) and the mixed ratio adopted were 200.8g: 65g and 40g for the first sample and 200.8g, 95g and 60g for the second sample respectively, thoroughly mixed manually by using the mixer. The mixture was then poured into a mold with a dimension 18cm × 16cm × 2.5cm. The particleboard was compacted using a compressive strength machine in two compacts. The particle boards of densities were varied between 0.75g/cm3and 0.79g/cm.3 An average moisture content of the boards was found to be 11.55%. The maximum compressive stress and the Maximum compressive load are observed for the Particle Board with sample 2. (i.e., 1.97N/mm2and 31.5KN) which have a good structural stability and strength. The results showedthat the corn cob, starch and wood glue (top bond) combination have high potential to be used indoor application for ceiling roof or by laminating Formica or veneers and furniture applications.en_US
dc.description.sponsorshipwolkite universityen_US
dc.identifier.uri
dc.language.isoenen_US
dc.publisherWOLKITE UNIVERSITYen_US
dc.subjectParticle Boarden_US
dc.subjectCorn Cobsen_US
dc.subjectModified Starch;en_US
dc.subjectTop Bond Glue.en_US
dc.titlePRODUCTION OF PARTICLEBOARD FROM CORN COBen_US
dc.typeThesisen_US

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